Meet Wevo at booth I33
Wevo will be exhibiting its latest solutions for potting, bonding, gap filling, and sealing of electrical and electronic components at booth I33. Wevo experts will showcase current developments in insulation and encapsulation technologies for electric drives and winding goods, highlighting how these materials support long-term performance and production reliability.
Technical seminar on encapsulating electronics – June 9, 2026
On June 9, the day before the exhibition, Wevo will host a dedicated in-person seminar focused on high-performance polyurethane solutions for demanding encapsulation applications.
With increasing power densities and more compact electronic systems, encapsulation requirements for thermal management, mechanical stability, and process reliability continue to grow – while manufacturers face tighter tolerances and the need for scalable production.
The seminar provides practical insights into material selection and application design, focussing on innovative polyurethane systems suited for automated manufacturing environments. Participants will gain application-oriented knowledge that can be directly applied to their own development and production processes.
