Wevo at Productronica 2025

From November 18 to 21, Productronica 2025 will take place in Munich.

As the world’s leading trade fair for electronics development and production, productronica offers a comprehensive overview of current trends, technologies and innovations along the entire value chain – from semiconductor manufacturing to production logistics.

This year, Wevo will once again be exhibiting and presenting its innovative materials for potting, bonding, gap filling and sealing electronic components as well as batteries and electrical energy storage systems.

Visit us at booth 466 in hall A4 to find out more about how Wevo solutions help enhance the performance and reliability of modern electronics in the long term.

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Wevo’s 2K silicone adhesive enables efficient production with adjustable pot life and curing.
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2K silicone adhesive for mechanically stable bonding supports targeted thermal management and efficient production processes.

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Carrier film coated with elastomer for flat hydrogen seals (Image source: Laufenberg GmbH).
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A process developed by Wevo and Laufenberg enables efficient, scalable production of flat hydrogen gaskets.

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