Potting-friendly design is an integral part of product development. It combines materials science, surface technology, component geometry and process management to form a holistic development approach.
Component design: the impact of design on the potting process
A common error in practice: the design is initially purely functional, without taking potting requirements into account. However, component design influences numerous parameters required for automated potting – such as venting, where the potting compound reliably displaces the air present within the component, thereby preventing air pockets. Cycle times are also affected by optimised flow paths resulting from the component design.
A further example: materials and surfaces – such as metals, plastics, paints or additives – react differently to potting compounds and affect their adhesion as well as flow properties. The development of stresses during subsequent operation, and thus the stability of the assembly over its service life, also depend on the substrates used.
Process parameters: prerequisites for smooth production
Even with a well-designed component, the potting process can reach its limits if process management is not properly coordinated. Typical potting defects – such as bubble formation, cracking or delamination – often arise not from the process itself, but from a lack of coordination between design and manufacturing.
In particular, any necessary pre-treatment steps, such as cleaning or surface activation, need to be taken into account. Component alignment, the potting sequence, layer thicknesses and curing conditions are also relevant factors and contribute to stable, reproducible electronics manufacturing when combined with the essential expertise.
Practical knowledge for developers and process managers
Wevo has been developing customised potting compounds for decades – and has first-hand experience of the challenges faced in development and manufacturing. In the company’s in-house seminars, experts share this knowledge directly with product developers, process engineers, manufacturing and production professionals as well as quality and plant engineers: in a practical, application-oriented manner and with specific solutions for common potting defects.
The next dates:
- 6–7 July 2026, Esslingen am Neckar (Germany). Topic: Mastering the techniques of potting and encapsulation in electrical engineering and electronics (German-language). Book your place now.
- 9 June 2026, Novi (MI, USA). Topic: Polyurethanes – a versatile solution for demanding applications. Book your place now.
Please also take a look at our online seminars. Topic: Processing of polyurethane casting compounds. Sign up now and participate from anywhere.
